SQUEEGEE DEFORMATION STUDY IN THE STENCIL PRINTING OF SOLDER PASTES

Authors
MANNAN SH EKERE NN ISMAIL I LO EK
Citation
Sh. Mannan et al., SQUEEGEE DEFORMATION STUDY IN THE STENCIL PRINTING OF SOLDER PASTES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(3), 1994, pp. 470-476
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
17
Issue
3
Year of publication
1994
Pages
470 - 476
Database
ISI
SICI code
1070-9886(1994)17:3<470:SDSITS>2.0.ZU;2-D
Abstract
We report on the results of an experimental comparison of different ty pes of squeegee blade used in the stencil printing of solder pastes fo r reflow soldering in SMT, concentrating on paste heights (scooping) a nd printing defects. We show how our experimental results for squeegee deformation into stencil apertures lead to the construction of a mode l for squeegee deformation. The model takes into account the force on the squeegee due to solder paste How and some of the non-Newtonian pro perties of the solder paste. An explanation is proposed for the differ ences in paste heights between apertures of different orientations.