Authors:
Eda, H
Zhou, L
Nakano, H
Kondo, R
Shimizu, J
Citation: H. Eda et al., Development of single step grinding system for large scale phi 300 Si wafer: A total integrated fixed-abrasive solution, CIRP ANN-M, 50(1), 2001, pp. 225-228
Authors:
Ii, M
Eda, H
Imai, T
Nishimura, M
Kawasaki, T
Shimizu, J
Yamamoto, T
Zhou, LB
Citation: M. Ii et al., Development of high water-content cutting fluids with a new concept - Fireprevention and environmental protection, PRECIS ENG, 24(3), 2000, pp. 231-236