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Results:
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Results: 10
Authors:
Hebert, C
Clair, S
Eisenmenger-Sittner, C
Bangert, H
Jouffrey, B
Schattschneider, P
Citation: C. Hebert et al., Electron energy-loss spectroscopy fine structure of the Cu L-2,L-3 ionization edge in substitutional Cu-Ni alloys, J PHYS-COND, 13(16), 2001, pp. 3791-3803
Authors:
Werner, WSM
Smekal, W
Stori, H
Eisenmenger-Sittner, C
Citation: Wsm. Werner et al., Angular dependence of the surface excitation probability for medium energyelectrons backscattered from Al and Si surfaces, J VAC SCI A, 19(5), 2001, pp. 2388-2393
Authors:
Rosner, M
Eisenmenger-Sittner, C
Hutter, H
Citation: M. Rosner et al., Investigations on codeposited aluminum-tin systems with SIMS, J TR MICROP, 19(1), 2001, pp. 91-98
Authors:
Werner, WSM
Smekal, W
Cabela, T
Eisenmenger-Sittner, C
Stori, H
Citation: Wsm. Werner et al., Angular distribution of surface excitations for electrons backscattered from Al and Si surfaces, J ELEC SPEC, 114, 2001, pp. 363-369
Authors:
Mayerhofer, KE
Neubauer, E
Eisenmenger-Sittner, C
Hutter, H
Citation: Ke. Mayerhofer et al., Characterisation of Cr intermediate layers in Cu-C-system with SIMS method, APPL SURF S, 179(1-4), 2001, pp. 275-280
Authors:
Eisenmenger-Sittner, C
Citation: C. Eisenmenger-sittner, Condensation and structure of multiphase thin films, VACUUM, 61(2-4), 2001, pp. 183-191
Authors:
Eisenmenger-Sittner, C
Citation: C. Eisenmenger-sittner, Surface evolution of polycrystalline Al films deposited on amorphous substrates at elevated temperatures, J APPL PHYS, 89(11), 2001, pp. 6085-6091
Authors:
Rosner, M
Eisenmenger-Sittner, C
Hutter, H
Citation: M. Rosner et al., Characterization of two-component metal coatings (Al/Sn) with SIMS, MIKROCH ACT, 133(1-4), 2000, pp. 267-271
Authors:
Eisenmenger-Sittner, C
Citation: C. Eisenmenger-sittner, Diffusion mediated film growth on polycrystalline substrates, J CRYST GR, 218(1), 2000, pp. 103-114
Authors:
Eisenmenger-Sittner, C
Citation: C. Eisenmenger-sittner, The application of rate equations to describe nucleation and growth on rough substrates: tin and lead on aluminium, J CRYST GR, 205(3), 1999, pp. 441-452
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