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Citation: Dr. Frear, THE MECHANICAL-BEHAVIOR OF INTERCONNECT MATERIALS FOR ELECTRONIC PACKAGING, JOM, 48(5), 1996, pp. 49-53

Authors: FREAR DR WINTERBOTTOM WL

Citation: Dr. Frear et Wl. Winterbottom, MATERIALS, PROCESSING, AND RELIABILITY ISSUES FOR PWB ASSEMBLIES, JOM, 47(6), 1995, pp. 26-26

Authors: FREAR DR VIANCO PT

Citation: Dr. Frear et Pt. Vianco, INTERMETALLIC GROWTH AND MECHANICAL-BEHAVIOR OF LOW AND HIGH-MELTING TEMPERATURE SOLDER ALLOYS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 25(7), 1994, pp. 1509-1523

Authors: JIN S FREAR DR MORRIS JW

Citation: S. Jin et al., UNTITLED, Journal of electronic materials, 23(8), 1994, pp. 691-691

Authors: VIANCO PT FREAR DR

Citation: Pt. Vianco et Dr. Frear, ISSUES IN THE REPLACEMENT OF LEAD-BEARING SOLDERS, JOM, 45(7), 1993, pp. 14-19

Authors: FREAR DR YOST FG

Citation: Dr. Frear et Fg. Yost, RELIABILITY OF SOLDER JOINTS, MRS bulletin, 18(12), 1993, pp. 49-54