Authors: Chiang, CK Wallace, WE Lynn, GW Feiler, D Xia, W

Citation: Ck. Chiang et al., Thermally induced stress relaxation and densification of spin-on-glass thin films, APPL PHYS L, 76(4), 2000, pp. 430-432

Authors: Zhao, B Feiler, D Ramanathan, V Liu, QZ Brongo, M Wu, J Zhang, H Kuei, JC Young, D Brown, J Vo, C Xia, W Chu, C Zhou, J Nguyen, C Tsau, L Dornisch, D Camilletti, L Ding, P Lai, G Chin, B Krishna, N Johnson, M Turner, J Ritzdorf, T Wu, G Cook, L

Citation: B. Zhao et al., Dual Damascene interconnect of copper and low permittivity dielectric for high performance integrated circuits, EL SOLID ST, 1(6), 1998, pp. 276-278