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Results: 1-8 |
Results: 8

Authors: Field, DP Dornisch, D Tong, HH
Citation: Dp. Field et al., Investigating the microstructure-reliability relationship in Cu damascene lines, SCR MATER, 45(9), 2001, pp. 1069-1075

Authors: Flinn, JE Field, DP Korth, GE Lillo, TM Macheret, J
Citation: Je. Flinn et al., The flow stress behavior of OFHC polycrystalline copper, ACT MATER, 49(11), 2001, pp. 2065-2074

Authors: Field, DP Nelson, TW Hovanski, Y Jata, KV
Citation: Dp. Field et al., Heterogeneity of crystallographic texture in friction stir welds of aluminum, MET MAT T A, 32(11), 2001, pp. 2869-2877

Authors: Kononenko, OV Matveev, VN Field, DP
Citation: Ov. Kononenko et al., Electromigration properties of multigrain aluminum thin film conductors asinfluenced by grain boundary structure, J MATER RES, 16(7), 2001, pp. 2124-2129

Authors: Andrzejewski, ME Field, DP Hineline, PN
Citation: Me. Andrzejewski et al., Changing behavior within session: Cyclicity and perseverance produced by varying the minimum ratio of a variable-ratio schedule, J EXP AN BE, 75(2), 2001, pp. 235-246

Authors: Kononenko, OV Matveev, VN Field, DP
Citation: Ov. Kononenko et al., EM activation energy in aluminum conductors tested by the drift velocity method, SCR MATER, 42(6), 2000, pp. 621-626

Authors: Field, DP Shipley, TF Cunningham, DW
Citation: Dp. Field et al., Prism adaptation to dynamic events, PERC PSYCH, 61(1), 1999, pp. 161-176

Authors: Wright, SI Field, DP
Citation: Si. Wright et Dp. Field, Recent studies of local texture and its influence on failure, MAT SCI E A, 257(1), 1998, pp. 165-170
Risultati: 1-8 |