AAAAAA

   
Results: 1-9 |
Results: 9
X-ray reflectivity of silicon on insulator wafers
Authors: Eymery, J Rieutord, F Fournel, F Buttard, D Moriceau, H
Citation: J. Eymery et al., X-ray reflectivity of silicon on insulator wafers, MAT SC S PR, 4(1-3), 2001, pp. 31-33
Structural characterization of ultra-thin (001) silicon films bonded onto (001) silicon wafers: a transmission electron microscopy study
Authors: Rousseau, K Rouviere, JL Fournel, F Moriceau, H
Citation: K. Rousseau et al., Structural characterization of ultra-thin (001) silicon films bonded onto (001) silicon wafers: a transmission electron microscopy study, MAT SC S PR, 4(1-3), 2001, pp. 101-104
Confinement induced enhancement of the emission in Er-implanted Si/SiO2 quantum wells fabricated on SOI substrates
Authors: Sotta, D Calvo, V Ulmer-Tuffigo, H Magnea, N Hadji, E Fournel, F Rouviere, JL Jalabert, D Moriceau, H Aspar, B
Citation: D. Sotta et al., Confinement induced enhancement of the emission in Er-implanted Si/SiO2 quantum wells fabricated on SOI substrates, MAT SCI E B, 81(1-3), 2001, pp. 43-45
High-energy x-ray reflectivity of buried interfaces created by wafer bonding - art. no. 125408
Authors: Rieutord, F Eymery, J Fournel, F Buttard, D Oeser, R Plantevin, O Moriceau, H Aspar, B
Citation: F. Rieutord et al., High-energy x-ray reflectivity of buried interfaces created by wafer bonding - art. no. 125408, PHYS REV B, 6312(12), 2001, pp. 5408
Ultra thin silicon films directly bonded onto silicon wafers
Authors: Fournel, F Moriceau, H Magnea, N Eymery, J Rouviere, JL Rousseau, K Aspar, B
Citation: F. Fournel et al., Ultra thin silicon films directly bonded onto silicon wafers, MAT SCI E B, 73(1-3), 2000, pp. 42-46
Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces
Authors: Buttard, D Eymery, J Rieutord, F Fournel, F Lubbert, D Baumbach, T Moriceau, H
Citation: D. Buttard et al., Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces, PHYSICA B, 283(1-3), 2000, pp. 103-107
Nanometric patterning with ultrathin twist bonded silicon wafers
Authors: Fournel, F Moriceau, H Magnea, N Eymery, J Buttard, D Rouviere, JL Rousseau, K Aspar, B
Citation: F. Fournel et al., Nanometric patterning with ultrathin twist bonded silicon wafers, THIN SOL FI, 380(1-2), 2000, pp. 10-14
Huge differences between low- and high-angle twist grain boundaries: The case of ultrathin (001) Si films bonded to (001) Si wafers
Authors: Rouviere, JL Rousseau, K Fournel, F Moriceau, H
Citation: Jl. Rouviere et al., Huge differences between low- and high-angle twist grain boundaries: The case of ultrathin (001) Si films bonded to (001) Si wafers, APPL PHYS L, 77(8), 2000, pp. 1135-1137
X-ray reflectivity of ultrathin twist-bonded silicon wafers
Authors: Eymery, J Fournel, F Rieutord, F Buttard, D Moriceau, H Aspar, B
Citation: J. Eymery et al., X-ray reflectivity of ultrathin twist-bonded silicon wafers, APPL PHYS L, 75(22), 1999, pp. 3509-3511
Risultati: 1-9 |