Authors: Fremont, H Deletage, JY Pintus, A Danto, Y

Citation: H. Fremont et al., Evaluation of the moisture sensitivity of molding compounds of IC's packages, J ELEC PACK, 123(1), 2001, pp. 16-18

Authors: Perichaud, MG Deletage, JY Fremont, H Danto, Y Faure, C

Citation: Mg. Perichaud et al., Reliability evaluation of adhesive bonded SMT components in industrial applications, MICROEL REL, 40(7), 2000, pp. 1227-1234