Authors:
SHIH DY
YEH HL
PARASZCZAK J
LEWIS J
GRAHAM W
NUNES S
NARAYAN C
MCGOUEY R
GALLIGAN E
CATALDO J
SERINO R
PERFECTO E
CHANG CA
DEUTSCH A
ROTHMAN L
RITSKO JJ
WILCZYNSKI JS
Citation: Dy. Shih et al., FACTORS AFFECTING THE INTERCONNECTION RESISTANCE AND YIELD IN MULTILAYER POLYIMIDE COPPER STRUCTURES, IEEE transactions on components, hybrids, and manufacturing technology, 16(1), 1993, pp. 74-88