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Authors: KROMANN GB GERKE RD HUANG WWX
Citation: Gb. Kromann et al., A HI-DENSITY C4 CBGA INTERCONNECT TECHNOLOGY FOR A CMOS MICROPROCESSOR/, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 166-173

Authors: BANKS DR BURNETTE TE GERKE RD MAMMO E MATTAY S
Citation: Dr. Banks et al., RELIABILITY COMPARISON OF 2 METALLURGIES FOR CERAMIC BALL GRID ARRAY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 53-57
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