Authors:
HAHN R
KAMP A
GINOLAS A
SCHMIDT M
WOLF J
GLAW V
TOPPER M
EHRMANN O
REICHL H
Citation: R. Hahn et al., HIGH-POWER MULTICHIP MODULES EMPLOYING THE PLANAR EMBEDDING TECHNIQUEAND MICROCHANNEL WATER HEAT SINKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 432-441