HIGH-POWER MULTICHIP MODULES EMPLOYING THE PLANAR EMBEDDING TECHNIQUEAND MICROCHANNEL WATER HEAT SINKS

This paper describes a novel packaging technology for high power multi chip modules (MCM's). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks w ith a matched CTE, as well as a low thermal resistivity assembling tec hnology. The MCM is fabricated bg means of the planar embedding techno logy. By planarizing the module backside a low thermal resistance betw een heat sink and dice tan be accomplished simultaneously for all embe dded components. A thermotest module of size 2 x 2 in capable of power dissipation of several hundred Watts was fabricated, Thermal resistan ce values below 0.6 Kcm(2)/W at 50 W/cm(2) chip flux have been achieve d.