Authors: HAHN R KAMP A GINOLAS A SCHMIDT M WOLF J GLAW V TOPPER M EHRMANN O REICHL H

Citation: R. Hahn et al., HIGH-POWER MULTICHIP MODULES EMPLOYING THE PLANAR EMBEDDING TECHNIQUEAND MICROCHANNEL WATER HEAT SINKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 432-441