Authors: GLICKMAN E OSIPOV N IVANOV A NATHAN M

Citation: E. Glickman et al., DIFFUSIONAL CREEP AS A STRESS-RELAXATION MECHANISM IN ELECTROMIGRATION, Journal of applied physics, 83(1), 1998, pp. 100-107

Authors: GLICKMAN E MOLOTSKII M

Citation: E. Glickman et M. Molotskii, ON THE EFFECT OF GRAIN-BOUNDARY SEGREGATION ON ELECTROMIGRATION DRIVING-FORCE IN THIN METAL-FILMS, Materials letters, 26(1-2), 1996, pp. 65-68

Authors: GLICKMAN E NATHAN M

Citation: E. Glickman et M. Nathan, ON THE UNUSUAL ELECTROMIGRATION BEHAVIOR OF COPPER INTERCONNECTS, Journal of applied physics, 80(7), 1996, pp. 3782-3791

Authors: GLADKIKH A LEREAH Y GLICKMAN E KARPOVSKI M PALEVSKI A SCHUBERT J

Citation: A. Gladkikh et al., HILLOCK FORMATION DURING ELECTROMIGRATION IN CU AND AL THIN-FILMS - 3-DIMENSIONAL GRAIN-GROWTH, Applied physics letters, 66(10), 1995, pp. 1214-1215

Authors: KLINGER L GLICKMAN E KATSMAN A LEVIN L

Citation: L. Klinger et al., TIME-DEPENDENCE OF STRESS AND HILLOCK DISTRIBUTIONS DURING ELECTROMIGRATION IN THIN METAL-FILM INTERCONNECTIONS, Materials science & engineering. B, Solid-state materials for advanced technology, 23(1), 1994, pp. 15-18