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Authors: VIANCO PT HLAVA PF KILGO AC

Citation: Pt. Vianco et al., INTERMETALLIC COMPOUND LAYER FORMATION BETWEEN COPPER AND HOT-DIPPED 100IN, 50IN-50SN, 100SN, AND 63SN-37PB COATINGS, Journal of electronic materials, 23(7), 1994, pp. 583-594