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Citation: Ik. Hui et B. Ralph, A STUDY OF THE STRENGTH AND SHAPE OF SURFACE-MOUNT TECHNOLOGY LEADLESS CHIP SOLDER JOINTS, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, 211(1), 1997, pp. 29-41

Authors: XIE DJ CHAN YC LAI JKL HUI IK

Citation: Dj. Xie et al., FATIGUE LIFE ESTIMATION OF SURFACE-MOUNT SOLDER JOINTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 669-678

Authors: XIE DJ CHAN YC LAI JKL HUI IK

Citation: Dj. Xie et al., FATIGUE LIFE STUDIES ON DEFECT-FREE SOLDER JOINTS FABRICATED FROM MODIFIED REFLOW SOLDERING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 679-684

Authors: LAW HW HUI IK POON KK

Citation: Hw. Law et al., AUTOMATIC PROCESS PLANNING SYSTEM FOR THE MANUFACTURE OF UNPOPULATED PRINTED-CIRCUIT BOARDS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 155-161

Authors: CHAN YC XIE DJ LAI JKL HUI IK

Citation: Yc. Chan et al., APPLICATION OF DIRECT STRAIN-MEASUREMENT TO FATIGUE STUDIES IN SURFACE SOLDER JOINTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(4), 1995, pp. 715-719

Authors: HUI IK RALPH B

Citation: Ik. Hui et B. Ralph, A STUDY OF THE INITIATION OF THE TOMBSTONING EFFECT ON LEADLESS CHIPS, International journal of machine tools & manufacture, 35(9), 1995, pp. 1251-1268