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Results: 1-12 |
Results: 12
High conductivity copper-boron alloys obtained by low temperature annealing
Authors: Zhang, SL Harper, JME D'Heurle, FM
Citation: Sl. Zhang et al., High conductivity copper-boron alloys obtained by low temperature annealing, J ELEC MAT, 30(1), 2001, pp. L1-L3
The use of in situ X-ray diffraction, optical scattering and resistance analysis techniques for evaluation of copper diffusion barriers in blanket films and damascene structures
Authors: Cabral, C Lavoie, C Harper, JME Jordan-Sweet, J
Citation: C. Cabral et al., The use of in situ X-ray diffraction, optical scattering and resistance analysis techniques for evaluation of copper diffusion barriers in blanket films and damascene structures, THIN SOL FI, 397(1-2), 2001, pp. 194-202
Formation of C54TiSi(2): Effects of niobium additions on the apparent activation energy
Authors: d'Heurle, FM Zhang, SL Lavoie, C Gas, P Cabral, C Harper, JME
Citation: Fm. D'Heurle et al., Formation of C54TiSi(2): Effects of niobium additions on the apparent activation energy, J APPL PHYS, 90(12), 2001, pp. 6409-6415
Two-step codeposition process for enhanced C54-TiSi2 formation in the Ti-Si binary system
Authors: Quintero, A Libera, M Cabral, C Lavoie, C Harper, JME
Citation: A. Quintero et al., Two-step codeposition process for enhanced C54-TiSi2 formation in the Ti-Si binary system, J APPL PHYS, 89(9), 2001, pp. 4879-4885
Optimization of Ta-Si-N thin films for use as oxidation-resistant diffusion barriers
Authors: Cabral, C Saenger, KL Kotecki, DE Harper, JME
Citation: C. Cabral et al., Optimization of Ta-Si-N thin films for use as oxidation-resistant diffusion barriers, J MATER RES, 15(1), 2000, pp. 194-198
Mechanisms for enhanced formation of the C54 phase of titanium silicide ultra-large-scale integration contacts
Authors: Harper, JME Cabral, C Lavoie, C
Citation: Jme. Harper et al., Mechanisms for enhanced formation of the C54 phase of titanium silicide ultra-large-scale integration contacts, ANN R MATER, 30, 2000, pp. 523-543
Detection of cobalt silicide phase formations by ultrafast optical measurements
Authors: Lavoie, C Cabral, C Harper, JME Tas, G Morath, CJ Stoner, RJ Maris, HJ
Citation: C. Lavoie et al., Detection of cobalt silicide phase formations by ultrafast optical measurements, THIN SOL FI, 374(1), 2000, pp. 42-48
Dissociation of dilute immiscible copper alloy thin films
Authors: Barmak, K Lucadamo, GA Cabral, C Lavoie, C Harper, JME
Citation: K. Barmak et al., Dissociation of dilute immiscible copper alloy thin films, J APPL PHYS, 87(5), 2000, pp. 2204-2214
Mechanisms for enhanced C54-TiSi2 formation in Ti-Ta alloy films on single-crystal Si
Authors: Quintero, A Libera, M Cabral, C Lavoie, C Harper, JME
Citation: A. Quintero et al., Mechanisms for enhanced C54-TiSi2 formation in Ti-Ta alloy films on single-crystal Si, J MATER RES, 14(12), 1999, pp. 4690-4700
Mechanisms for microstructure evolution in electroplated copper thin filmsnear room temperature
Authors: Harper, JME Cabral, C Andricacos, PC Gignac, L Noyan, IC Rodbell, KP Hu, CK
Citation: Jme. Harper et al., Mechanisms for microstructure evolution in electroplated copper thin filmsnear room temperature, J APPL PHYS, 86(5), 1999, pp. 2516-2525
Phase formation and resistivity in the ternary system Ti-Nb-Si
Authors: Mouroux, A Roux, M Zhang, SL d'Heurle, FM Cabral, C Lavoie, C Harper, JME
Citation: A. Mouroux et al., Phase formation and resistivity in the ternary system Ti-Nb-Si, J APPL PHYS, 86(4), 1999, pp. 2323-2329
In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere
Authors: Zhang, SL Lavoie, C Cabral, C Harper, JME d'Heurle, FM Jordan-Sweet, J
Citation: Sl. Zhang et al., In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere, J APPL PHYS, 85(5), 1999, pp. 2617-2626
Risultati: 1-12 |