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Citation: Aa. Rostami et al., Parametric study of thermal constriction resistance, HEAT MASS T, 37(1), 2001, pp. 5-10

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Authors: Wong, CW Seetharamu, KN Alimuddin, Z Hassan, AY Goh, TJ

Citation: Cw. Wong et al., Three-dimensional analysis of an enhanced cooling system for electronic packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 431-437