Three-dimensional analysis of an enhanced cooling system for electronic packaging

This study investigates the maximum heat flux and its corresponding superhe at temperature for a straight pin fin ill a boiling FC-72. Investigations a re carried out numerically under atmospheric pressure by solving ii three d imensional heat conduction equation in steady state. The Finite element met hod (FEM) is used to investigate this phenomenon. The numerical results are ill good agreement with the available experimental results. One-dimensiona l analysis of boiling on a straight pin fill had been carried out. Therefor e, comparison will be made between the one and three-dimensional analysis r esults. The effect of length and diameter on the maximum heat flux (MHF) an d the operational stability are also investigated.