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Results: 1-7 |
Results: 7
Experimental evaluation of an optimized radiation cooling geometry for ionprojection lithography masks
Authors: Torres, JL Nounu, HN Wasson, JR Wolfe, JC Lutz, J Haugeneder, E Loschner, H Stengl, G Kaesmaier, R
Citation: Jl. Torres et al., Experimental evaluation of an optimized radiation cooling geometry for ionprojection lithography masks, J VAC SCI B, 18(6), 2000, pp. 3207-3209
Comparison of silicon stencil mask distortion measurements with finite element analysis
Authors: Ehrmann, A Struck, T Chalupka, A Haugeneder, E Loschner, H Butschke, J Irmscher, M Letzkus, F Springer, R Degen, A Rangelow, IW Shi, F Sossna, E Volland, B Engelstad, R Lovell, E Tejeda, R
Citation: A. Ehrmann et al., Comparison of silicon stencil mask distortion measurements with finite element analysis, J VAC SCI B, 17(6), 1999, pp. 3107-3111
Directly sputtered stress-compensated carbon protective layer for silicon stencil masks
Authors: Hudek, P Hrkut, P Drzik, M Kostic, I Belov, M Torres, J Wasson, J Wolfe, JC Degen, A Rangelow, IW Voigt, J Butschke, J Letzkus, F Springer, R Ehrmann, A Kaesmaier, R Kragler, K Mathuni, J Haugeneder, E Loschner, H
Citation: P. Hudek et al., Directly sputtered stress-compensated carbon protective layer for silicon stencil masks, J VAC SCI B, 17(6), 1999, pp. 3127-3131
Stress relief structures for ion-beam projection lithography masks
Authors: Tejeda, R Engelstad, R Lovell, E Haugeneder, E Loschner, H
Citation: R. Tejeda et al., Stress relief structures for ion-beam projection lithography masks, MICROEL ENG, 46(1-4), 1999, pp. 481-484
Finite element simulation of ion-beam lithography mask fabrication
Authors: Tejeda, R Frisque, G Engelstad, R Lovell, E Haugeneder, E Loschner, H
Citation: R. Tejeda et al., Finite element simulation of ion-beam lithography mask fabrication, MICROEL ENG, 46(1-4), 1999, pp. 485-488
p-n junction-based wafer flow process for stencil mask fabrication
Authors: Rangelow, IW Shi, F Volland, B Sossna, E Petrashenko, A Hudek, P Sunyk, R Butschke, J Letzkus, F Springer, R Ehrmann, A Gross, G Kaesmaier, R Oelmann, A Struck, T Unger, G Chalupka, A Haugeneder, E Lammer, G Loschner, H Tejeda, R Lovell, E Engelstad, R
Citation: Iw. Rangelow et al., p-n junction-based wafer flow process for stencil mask fabrication, J VAC SCI B, 16(6), 1998, pp. 3592-3598
Optimization of the temperature distribution across stencil mask membranesunder ion beam exposure
Authors: Kim, B Engelstad, R Lovell, E Chalupka, A Haugeneder, E Lammer, G Loschner, H Lutz, J Stengl, G
Citation: B. Kim et al., Optimization of the temperature distribution across stencil mask membranesunder ion beam exposure, J VAC SCI B, 16(6), 1998, pp. 3602-3605
Risultati: 1-7 |