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Results:
1-9
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Results: 9
Authors:
Rosen, D
Olsson, J
Hedlund, C
Citation: D. Rosen et al., Membrane covered electrically isolated through-wafer via holes, J MICROM M, 11(4), 2001, pp. 344-347
Authors:
Kohler, J
Strandman, C
Vallin, O
Hedlund, C
Backlund, Y
Citation: J. Kohler et al., Silicon fusion bond interfaces resilient to wet anisotropic etchants, J MICROM M, 11(4), 2001, pp. 359-363
Authors:
Jonsson, K
Kohler, J
Hedlund, C
Stenmark, L
Citation: K. Jonsson et al., Oxygen plasma wafer bonding evaluated by the Weibull fracture probability method, J MICROM M, 11(4), 2001, pp. 364-370
Authors:
Jonsson, LB
Westlinder, J
Engelmark, F
Hedlund, C
Du, J
Smith, U
Blom, HO
Citation: Lb. Jonsson et al., Patterning of tantalum pentoxide, a high epsilon material, by inductively coupled plasma etching, J VAC SCI B, 18(4), 2000, pp. 1906-1910
Authors:
Pasquariello, D
Lindeberg, M
Hedlund, C
Hjort, K
Citation: D. Pasquariello et al., Surface energy as a function of self-bias voltage in oxygen plasma wafer bonding, SENS ACTU-A, 82(1-3), 2000, pp. 239-244
Authors:
Pasquariello, D
Hedlund, C
Hjort, K
Citation: D. Pasquariello et al., Oxidation and induced damage in oxygen plasma in situ wafer bonding, J ELCHEM SO, 147(7), 2000, pp. 2699-2703
Authors:
Thornell, G
Ericson, F
Hedlund, C
Ohrmalm, J
Schweitz, JA
Portnoff, G
Citation: G. Thornell et al., Residual stress in sputtered gold films on quartz measured by the cantilever beam deflection technique, IEEE ULTRAS, 46(4), 1999, pp. 981-992
Authors:
Jonsson, LB
Hedlund, C
Katardjiev, IV
Berg, S
Citation: Lb. Jonsson et al., Compositional variations of sputter deposited Ti/W barrier layers on substrates with pronounced surface topography, THIN SOL FI, 348(1-2), 1999, pp. 227-232
Authors:
Writer, WDR
Stienstra, R
Hedlund, C
Selander, D
Citation: Wdr. Writer et al., Ropivacaine and bupivacaine for analgesia in labour, BR J ANAEST, 82(4), 1999, pp. 652-653
Risultati:
1-9
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