Authors: Hotchkiss, G Amador, G Edwards, D Hundt, P Stark, L Stierman, R Heinen, G

Citation: G. Hotchkiss et al., Wafer level packaging of a tape flip-chip chip scale packages, MICROEL REL, 41(5), 2001, pp. 705-713

Authors: Buford, D Mologne, T McGrath, S Heinen, G Snyder, S

Citation: D. Buford et al., Midterm results of arthroscopic co-planing of the acromioclavicular joint, J SHOUL ELB, 9(6), 2000, pp. 498-501