Authors: Li, H Jin, S Bender, H Lanckmans, F Heyvaert, I Maex, K Froyen, L

Citation: H. Li et al., Characterization of WF6/N-2/H-2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization, J VAC SCI B, 18(1), 2000, pp. 242-251

Authors: Heyvaert, I Van Hove, M Witvrouw, A Maex, K Saerens, A Roussel, P Bender, H

Citation: I. Heyvaert et al., Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminum metallisations, MICROEL ENG, 50(1-4), 2000, pp. 291-299