Authors: Hu, JC Chang, TC Wu, CW Chen, LJ Hsiung, CS Hsieh, WY Lur, W Yew, TR

Citation: Jc. Hu et al., Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications, J VAC SCI A, 18(4), 2000, pp. 1207-1210