Authors: Wang, KP Huang, YY Chandra, A Hu, KX

Citation: Kp. Wang et al., Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies, IEEE T COMP, 23(2), 2000, pp. 309-316

Authors: Chandra, A Huang, Y Jiang, ZQ Hu, KX Fu, G

Citation: A. Chandra et al., A model of crack nucleation in layered electronic assemblies under thermalcycling, J ELEC PACK, 122(3), 2000, pp. 220-226