Authors: Li, CP Hui, IK

Citation: Cp. Li et Ik. Hui, Environmental impact evaluation model for industrial processes, ENVIR MANAG, 27(5), 2001, pp. 729-737

Authors: Law, HW Tam, HY Chan, AHS Hui, IK

Citation: Hw. Law et al., Object-oriented knowledge-based computer-aided process planning system forbare circuit boards manufacturing, COMPUT IND, 45(2), 2001, pp. 137-153

Authors: Hui, IK Ralph, B

Citation: Ik. Hui et B. Ralph, Voiding and printing characteristics of solder paste at different degrees of exposure, P I MEC E B, 214(2), 2000, pp. 137-148

Authors: Hui, IK Law, HW

Citation: Ik. Hui et Hw. Law, An alternative approach for the analysis of intermetallic compounds in SMTsolder joints, SOLDER S MT, 12(1), 2000, pp. 23-31

Authors: Hui, IK Ipyn, WLR

Citation: Ik. Hui et Wlr. Ipyn, Wetting analysis of leadless chips in surface mount technology, INT J ADV M, 16(9), 2000, pp. 675-680

Authors: Hui, IK Ralph, B

Citation: Ik. Hui et B. Ralph, The effects of exposure time on tackiness and rheology of solder paste, P I MEC E B, 212(7), 1998, pp. 517-524