Authors:
Ishitsuka, F
Iwasaki, N
Ohira, T
Suzuki, Y
Ando, Y
Citation: F. Ishitsuka et al., A compact three-dimensional packaging technique using super-fine-pitch coaxial connector arrays for on-board satellite equipment, IEEE T AD P, 23(3), 2000, pp. 530-537
Authors:
Ishitsuka, F
Iwasaki, N
Hirose, M
Yanagibashi, M
Ichino, H
Ando, Y
Citation: F. Ishitsuka et al., A compact MU-interface, 2,5-Gb/s optical transmitter module with LD-driverIC embedded in L-shaped wiring substrate, IEEE T AD P, 22(3), 1999, pp. 451-459