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Results: 2
Development of joining technology for Be/Cu-alloy and Be/SS by HIP
Authors:
Kuroda, T Hatano, T Enoeda, M Sato, S Furuya, K Takatsu, H Iwadachi, T Nishida, K
Citation:
T. Kuroda et al., Development of joining technology for Be/Cu-alloy and Be/SS by HIP, J NUCL MAT, 263, 1998, pp. 258-264
Interface formation and strength of Be/DSCu diffusion bonding
Authors:
Makino, T Iwadachi, T
Citation:
T. Makino et T. Iwadachi, Interface formation and strength of Be/DSCu diffusion bonding, J NUCL MAT, 263, 1998, pp. 313-317
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