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Results:
1-7
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Results: 7
Authors:
Chun, S
Swaminathan, M
Smith, LD
Srinivasan, J
Jin, Z
Iyer, MK
Citation: S. Chun et al., Modeling of simultaneous switching noise in high speed systems, IEEE T AD P, 24(2), 2001, pp. 132-142
Authors:
Khan, N",Pinjala,"Iyer, MK
Chuan, TK
Jin, WX
Citation: Mk. Khan, N",pinjala,"iyer et al., Thermal enhancement of desk top computer by chassis design optimization, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 60-64
Authors:
Loh, CV
Toh, KC
Pinjala, D
Iyer, MK
Citation: Cv. Loh et al., Development of effective compact models for depopulated ball grid array packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 131-137
Authors:
Pinjala, D
Iyer, MK
Guan, CS
Rasiah, IJ
Citation: D. Pinjala et al., Thermal characterization of vias using compact models, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 144-147
Authors:
Yeo, YK
Lee, SY
Iyer, MK
Leong, MS
Citation: Yk. Yeo et al., A comparative study of different plane modelling methodologies for high density electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 210-213
Authors:
Jin, Z
Iyer, MK
Qiu, YL
Ooi, BL
Leong, MS
Citation: Z. Jin et al., S-parameter based technique for simultaneous switching noise analysis in electronic packages, IEEE T AD P, 22(3), 1999, pp. 267-273
Authors:
Iyer, MK
Bushnell, ML
Citation: Mk. Iyer et Ml. Bushnell, Effect of noise on analog circuit testing, J ELEC TEST, 15(1-2), 1999, pp. 11-22
Risultati:
1-7
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