A comparative study of different plane modelling methodologies for high density electronic packages

Authors
Yeo, YK Lee, SY Iyer, MK Leong, MS
Citation
Yk. Yeo et al., A comparative study of different plane modelling methodologies for high density electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 210-213
Citations number
4
Categorie Soggetti
Current Book Contents
Journal title
PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE → ACNP
Year of publication
2000
Pages
210 - 213
Database
ISI
SICI code
Abstract
There are various methods to model a power and ground plane pair found in t he power distribution network of IC packages and printed circuit boards. In this paper, three such methods shall be examined. The simulation results w ill be compared with measurement and the relative merits and drawbacks of t hese methods will be discussed.