Authors:
TAN Q
ZHANG WG
SCHAIBLE B
BOND LJ
JU TH
LEE YC
Citation: Q. Tan et al., THERMOSONIC FLIP-CHIP BONDING USING LONGITUDINAL ULTRASONIC VIBRATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 53-58
Citation: Ts. Mclaren et al., THERMOSONIC BONDING OF AN OPTICAL TRANSCEIVER BASED ORE AN 8X8 VERTICAL-CAVITY SURFACE-EMITTING LASER ARRAY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(2), 1997, pp. 152-160
Authors:
JU TH
LIN W
LEE YC
MCKNIGHT DJ
JOHNSON KM
Citation: Th. Ju et al., PACKAGING OF A 128 BY 128 LIQUID-CRYSTAL-ON-SILICON SPATIAL LIGHT-MODULATOR USING SELF-PULLING SOLDERING, IEEE photonics technology letters, 7(9), 1995, pp. 1010-1012