AAAAAA

   
Results: 1-9 |
Results: 9
Fluxless wetting properties of top surface metallurgy in different Pb-freesolders
Authors: Hong, SM Park, JY Jung, JP Kang, CS
Citation: Sm. Hong et al., Fluxless wetting properties of top surface metallurgy in different Pb-freesolders, MATER TRANS, 42(7), 2001, pp. 1423-1427
Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis
Authors: Shin, YE Lee, KW Chang, KH Jung, SB Jung, JP
Citation: Ye. Shin et al., Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis, MATER TRANS, 42(5), 2001, pp. 809-813
Microstructure and mechanical properties of partial melted joint using offeutectic lead-free solders
Authors: Ha, JS Kang, CS Park, JY Jung, JP
Citation: Js. Ha et al., Microstructure and mechanical properties of partial melted joint using offeutectic lead-free solders, MATER TRANS, 42(5), 2001, pp. 814-819
A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5mass%Ag and Sn-37 mass%Pb solder
Authors: Park, CB Hong, SM Jung, JP Kang, CS Shin, YE
Citation: Cb. Park et al., A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5mass%Ag and Sn-37 mass%Pb solder, MATER TRANS, 42(5), 2001, pp. 820-824
Fluxless wetting properties of the UBM-coated Si-wafer to pH-free solders under different atmosphere
Authors: Hong, SM Park, JY Kang, CS Jung, JP
Citation: Sm. Hong et al., Fluxless wetting properties of the UBM-coated Si-wafer to pH-free solders under different atmosphere, MATER TRANS, 42(3), 2001, pp. 520-527
Fluxless wetting properties of one-side-coated under bump metallurgy and top surface metallurgy
Authors: Hong, SM Park, JY Jung, JP Kang, CS
Citation: Sm. Hong et al., Fluxless wetting properties of one-side-coated under bump metallurgy and top surface metallurgy, J ELEC MAT, 30(8), 2001, pp. 937-944
Study on the soldering in partial melting state (1) analysis of surface tension and wettability
Authors: Park, JY Ha, JS Kang, CS Shin, KS Kim, MI Jung, JP
Citation: Jy. Park et al., Study on the soldering in partial melting state (1) analysis of surface tension and wettability, J ELEC MAT, 29(10), 2000, pp. 1145-1152
The analysis of the withdrawal force curve of the wetting balance curve
Authors: Park, JY Jung, JP Kang, CS
Citation: Jy. Park et al., The analysis of the withdrawal force curve of the wetting balance curve, IEEE T COMP, 22(3), 1999, pp. 372-377
The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders
Authors: Park, JY Kang, CS Jung, JP
Citation: Jy. Park et al., The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders, J ELEC MAT, 28(11), 1999, pp. 1256-1262
Risultati: 1-9 |