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Results: 1-12 |
Results: 12
SIGNIFICANTLY IMPROVED MECHANICAL-PROPERTIES OF BI-SN SOLDER ALLOYS BY AG-DOPING
Authors: MCCORMACK M CHEN HS KAMMLOTT GW JIN S
Citation: M. Mccormack et al., SIGNIFICANTLY IMPROVED MECHANICAL-PROPERTIES OF BI-SN SOLDER ALLOYS BY AG-DOPING, Journal of electronic materials, 26(8), 1997, pp. 954-958
WAVE SOLDERING WITH A LOW-MELTING POINT BI-SN ALLOY - EFFECTS OF SOLDERING TEMPERATURES AND CIRCUIT-BOARD FINISHES
Authors: MCCORMACK M ARTAKI I JIN S JACKSON AM MACHUSAK DM KAMMLOTT GW FINLEY DW
Citation: M. Mccormack et al., WAVE SOLDERING WITH A LOW-MELTING POINT BI-SN ALLOY - EFFECTS OF SOLDERING TEMPERATURES AND CIRCUIT-BOARD FINISHES, Journal of electronic materials, 25(7), 1996, pp. 1128-1131
A NOVEL PLATING PROCESS FOR MICROENCAPSULATING METAL-HYDRIDES
Authors: LAW HH VYAS B ZAHURAK SM KAMMLOTT GW
Citation: Hh. Law et al., A NOVEL PLATING PROCESS FOR MICROENCAPSULATING METAL-HYDRIDES, Journal of the Electrochemical Society, 143(8), 1996, pp. 2596-2601
EXTRAORDINARY ADHESION OF A SIMPLE NIOBIUM METAL-BONDING STRUCTURE
Authors: CHEN HS BACON DD LAW HH KAMMLOTT GW WU TC
Citation: Hs. Chen et al., EXTRAORDINARY ADHESION OF A SIMPLE NIOBIUM METAL-BONDING STRUCTURE, Journal of materials research, 10(11), 1995, pp. 2870-2874
INDENTATION BEHAVIOR OF SODA-LIME SILICA GLASS, FUSED-SILICA, AND SINGLE-CRYSTAL QUARTZ AT LIQUID-NITROGEN TEMPERATURE
Authors: KURKJIAN CR KAMMLOTT GW CHAUDHRI MM
Citation: Cr. Kurkjian et al., INDENTATION BEHAVIOR OF SODA-LIME SILICA GLASS, FUSED-SILICA, AND SINGLE-CRYSTAL QUARTZ AT LIQUID-NITROGEN TEMPERATURE, Journal of the American Ceramic Society, 78(3), 1995, pp. 737-744
ENHANCED SOLDER ALLOY PERFORMANCE BY MAGNETIC DISPERSIONS
Authors: MCCORMACK M JIN S KAMMLOTT GW
Citation: M. Mccormack et al., ENHANCED SOLDER ALLOY PERFORMANCE BY MAGNETIC DISPERSIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(3), 1994, pp. 452-457
LOW-TEMPERATURE THINNING OF THICK CHEMICALLY VAPOR-DEPOSITED DIAMOND FILMS WITH A MOLTEN CE-NI ALLOY
Authors: MCCORMACK M JIN S GRAEBNER JE TIEFEL TH KAMMLOTT GW
Citation: M. Mccormack et al., LOW-TEMPERATURE THINNING OF THICK CHEMICALLY VAPOR-DEPOSITED DIAMOND FILMS WITH A MOLTEN CE-NI ALLOY, DIAMOND AND RELATED MATERIALS, 3(3), 1994, pp. 254-258
SIGNIFICANTLY IMPROVED MECHANICAL-PROPERTIES OF PB-FREE, SN-ZN-IN SOLDER ALLOY BY AG DOPING
Authors: MCCORMACK M KAMMLOTT GW CHEN HS JIN S
Citation: M. Mccormack et al., SIGNIFICANTLY IMPROVED MECHANICAL-PROPERTIES OF PB-FREE, SN-ZN-IN SOLDER ALLOY BY AG DOPING, Applied physics letters, 65(9), 1994, pp. 1100-1102
ANISOTROPY IN DIAMOND ETCHING WITH MOLTEN CERIUM
Authors: JIN S ZHU W SIEGRIST T TIEFEL TH KAMMLOTT GW GRAEBNER JE MCCORMACK M
Citation: S. Jin et al., ANISOTROPY IN DIAMOND ETCHING WITH MOLTEN CERIUM, Applied physics letters, 65(21), 1994, pp. 2675-2677
NEW LEAD-FREE, SN-AG-ZN-CU SOLDER ALLOY WITH IMPROVED MECHANICAL-PROPERTIES
Authors: MCCORMACK M KAMMLOTT GW CHEN HS JIN S
Citation: M. Mccormack et al., NEW LEAD-FREE, SN-AG-ZN-CU SOLDER ALLOY WITH IMPROVED MECHANICAL-PROPERTIES, Applied physics letters, 65(10), 1994, pp. 1233-1235
SUPPRESSION OF MICROSTRUCTURAL COARSENING AND CREEP DEFORMATION IN A LEAD-FREE SOLDER
Authors: MCCORMACK M JIN S KAMMLOTT GW
Citation: M. Mccormack et al., SUPPRESSION OF MICROSTRUCTURAL COARSENING AND CREEP DEFORMATION IN A LEAD-FREE SOLDER, Applied physics letters, 64(5), 1994, pp. 580-582
NEW PB-FREE SOLDER ALLOY WITH SUPERIOR MECHANICAL-PROPERTIES
Authors: MCCORMACK M JIN S KAMMLOTT GW CHEN HS
Citation: M. Mccormack et al., NEW PB-FREE SOLDER ALLOY WITH SUPERIOR MECHANICAL-PROPERTIES, Applied physics letters, 63(1), 1993, pp. 15-17
Risultati: 1-12 |