Authors: ROGERS C COPPETA J RACZ L PHILIPOSSIAN A KAUFMAN FB BRAMONO D

Citation: C. Rogers et al., ANALYSIS OF FLOW BETWEEN A WAFER AND PAD DURING CMP PRECESSES, Journal of electronic materials, 27(10), 1998, pp. 1082-1087

Authors: THOMAS RR KAUFMAN FB KIRLEIS JT BELSKY RA

Citation: Rr. Thomas et al., WETTABILITY OF POLISHED SILICON-OXIDE SURFACES, Journal of the Electrochemical Society, 143(2), 1996, pp. 643-648

Authors: HU CK LUTHER B KAUFMAN FB HUMMEL J UZOH C PEARSON DJ

Citation: Ck. Hu et al., COPPER INTERCONNECTION INTEGRATION AND RELIABILITY, Thin solid films, 262(1-2), 1995, pp. 84-92

Authors: TORRANCE JB SCOTT BA KAUFMAN FB

Citation: Jb. Torrance et al., OPTICAL-PROPERTIES OF CHARGE-TRANSFER SALTS OF TETRACYANOQUINODIMETHANE (TCNQ) (REPRINTED FROM SOLID STATES COMMUN, VOL 17, PG 1369-1373, 1973), Solid state communications, 88(11-12), 1993, pp. 971-975

Authors: BRUSIC V FRISCH MA ELDRIDGE BN KAUFMAN FB PETERSEN TA SCHROTT A FRANKEL GS

Citation: V. Brusic et al., GROWTH-KINETICS, POLYMERIZATION AND PROTECTION OF CU-X-BTA FILMS, Revue de métallurgie, 90(12), 1993, pp. 1631-1635