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Results:
1-15
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Results: 15
Authors:
KULOJARVI K
KIVILAHTI JK
Citation: K. Kulojarvi et Jk. Kivilahti, A LOW-TEMPERATURE INTERCONNECTION METHOD FOR ELECTRONICS ASSEMBLY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 288-291
Authors:
KORHONEN TM
KIVILAHTI JK
Citation: Tm. Korhonen et Jk. Kivilahti, THERMODYNAMICS OF THE SN-IN-AG SOLDER SYSTEM, Journal of electronic materials, 27(3), 1998, pp. 149-158
Authors:
OBERNDORFF PJTL
KODENTSOV AA
VUORINEN V
KIVILAHTI JK
VANLOO FJJ
Citation: Pjtl. Oberndorff et al., PHASE-RELATIONS IN THE SN-AG-SB SYSTEM AT 220-DEGREES-C, Berichte der Bunsengesellschaft fur Physikalische Chemie, 102(9), 1998, pp. 1321-1325
Authors:
KODENTSOV AA
VANDAL MJH
KIVILAHTI JK
VANLOO FJJ
Citation: Aa. Kodentsov et al., THERMODYNAMICS AND KINETICS OF INTERNAL REACTIONS - NITRIDATION OF NI-CR ALLOYS, Berichte der Bunsengesellschaft fur Physikalische Chemie, 102(9), 1998, pp. 1326-1333
Authors:
RONKA KJ
VANLOO FJJ
KIVILAHTI JK
Citation: Kj. Ronka et al., THE LOCAL NOMINAL COMPOSITION-USEFUL CONCEPT FOR MICROJOINING AND INTERCONNECTION APPLICATIONS, Scripta materialia, 37(10), 1997, pp. 1575-1581
Authors:
RONKA KJ
VANLOO FJJ
KIVILAHTI JK
Citation: Kj. Ronka et al., THERMODYNAMIC AND KINETIC-STUDY OF DIFFUSION PATHS IN THE SYSTEM CU-AG-ZN, Zeitschrift fur Metallkunde, 88(1), 1997, pp. 9-13
Authors:
RONKA KJ
KODENTSOV AA
VANLOON PJH
KIVILAHTI JK
VANLOO FJJ
Citation: Kj. Ronka et al., THERMODYNAMIC AND KINETIC-STUDY OF DIFFUSION PATHS IN THE SYSTEM CU-FE-NI, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 27(8), 1996, pp. 2229-2238
Authors:
KODENTSOV AA
GULPEN JH
CSERHATI C
KIVILAHTI JK
VANLOO FJJ
Citation: Aa. Kodentsov et al., HIGH-TEMPERATURE NITRIDATION OF NI-CR ALLOYS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 27(1), 1996, pp. 59-69
Authors:
KIVILAHTI JK
Citation: Jk. Kivilahti, MODELING JOINING MATERIALS FOR MICROELECTRONICS PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(2), 1995, pp. 326-333
Authors:
PAULASTO M
KIVILAHTI JK
Citation: M. Paulasto et Jk. Kivilahti, FORMATION OF INTERFACIAL MICROSTRUCTURE IN BRAZING OF SI3N4 WITH TI-ACTIVATED AG-CU FILLER ALLOYS, Scripta metallurgica et materialia, 32(8), 1995, pp. 1209-1214
Authors:
CECCONE G
NICHOLAS MG
PETEVES SD
KODENTSOV AA
KIVILAHTI JK
VANLOO FJJ
Citation: G. Ceccone et al., THE BRAZING OF SI3N4 WITH NI-CR-SI ALLOYS, Journal of the European Ceramic Society, 15(6), 1995, pp. 563-572
Authors:
PAULASTO M
VANLOO FJJ
KIVILAHTI JK
Citation: M. Paulasto et al., THERMODYNAMIC AND EXPERIMENTAL-STUDY OF TI-AG-CU ALLOYS, Journal of alloys and compounds, 220(1-2), 1995, pp. 136-141
Authors:
KONONEN MHO
LAVONIUS ET
KIVILAHTI JK
Citation: Mho. Kononen et al., SEM OBSERVATIONS ON STRESS-CORROSION CRACKING OF COMMERCIALLY PURE TITANIUM IN A TOPICAL FLUORIDE SOLUTION, Dental materials, 11(4), 1995, pp. 269-272
Authors:
PAULASTO M
KIVILAHTI JK
VANLOO FJJ
Citation: M. Paulasto et al., INTERFACIAL REACTIONS IN TI SI3N4 AND TIN/SI DIFFUSION COUPLES/, Journal of applied physics, 77(9), 1995, pp. 4412-4416
Authors:
PAULASTO M
VANLOO FJJ
KIVILAHTI JK
Citation: M. Paulasto et al., STABILITY AND FORMATION KINETICS OF TIN AND SILICIDES IN THE TI SI3N4DIFFUSION COUPLE/, Journal de physique. IV, 3(C7), 1993, pp. 1069-1072
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