Authors:
SEKIGUCHI M
SAWADA K
FUKUMOTO M
KOUZAKI T
Citation: M. Sekiguchi et al., ELECTROMIGRATION IN ALSICU TIN/TI INTERCONNECTS WITH TI AND TIN ADDITIONAL LAYERS/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(5), 1994, pp. 2992-2996