Authors: Pinardi, K Lai, ZH Vogel, D Kang, YL Liu, J Liu, S Haug, R Willander, M

Citation: K. Pinardi et al., Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints, IEEE T COMP, 23(3), 2000, pp. 447-451

Authors: Kang, YL Shrestha, GB Lie, TT

Citation: Yl. Kang et al., Improvement of power system dynamic performance with the magnitude and phase angle control of static phase shifter, ELEC POW SY, 55(2), 2000, pp. 121-128

Authors: Xu, QJ Yu, SW Kang, YL

Citation: Qj. Xu et al., Residual stress analysis of functionally gradient materials, MECH RES CO, 26(1), 1999, pp. 55-60