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Results:
1-19
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Results: 19
Authors:
Niu, C
Magtoto, NP
Kelber, JA
Citation: C. Niu et al., Behavior of ultrathin Al2O3 films in very high electric fields: Scanning tunneling microscope-induced void formation and dielectric breakdown, J VAC SCI A, 19(4), 2001, pp. 1947-1952
Authors:
Ekstrom, BM
Lee, S
Magtoto, N
Kelber, JA
Citation: Bm. Ekstrom et al., Cu wetting and interfacial stability on clean and nitrided tungsten surfaces, APPL SURF S, 171(3-4), 2001, pp. 275-282
Authors:
Magtoto, NP
Niu, C
Anzaldua, M
Kelber, JA
Jennison, DR
Citation: Np. Magtoto et al., STM-induced void formation at the Al2O3/Ni3Al(111) interface, SURF SCI, 472(3), 2001, pp. L157-L163
Authors:
Seshadri, G
Xu, HC
Kelber, JA
Citation: G. Seshadri et al., Combined ultrahigh vacuum electrochemistry studies of copper and sulfur-modified copper electrodes in mildly acidic phosphate electrolyte, J ELCHEM SO, 148(6), 2001, pp. B222-B227
Authors:
Zhao, X
Leavy, M
Magtoto, NP
Kelber, JA
Citation: X. Zhao et al., Copper wetting of a tantalum silicate surface: Implications for interconnect technology, APPL PHYS L, 79(21), 2001, pp. 3479-3481
Authors:
Addepalli, S
Magtoto, NP
Kelber, JA
Citation: S. Addepalli et al., Interactions at the Ni3Al(111)-S-Al2O3 interface at elevated temperatures:Ordering of Al2O3 on S-modified substrate, LANGMUIR, 16(22), 2000, pp. 8352-8359
Authors:
Seshadri, G
Mo, H
Kelber, JA
Citation: G. Seshadri et al., Spectroelectrochemical studies of nickel oxidation in aerated phosphate solutions, LANGMUIR, 16(14), 2000, pp. 6037-6042
Authors:
Shepherd, K
Niu, C
Martini, D
Kelber, JA
Citation: K. Shepherd et al., Behavior of Cu0.6Al0.4 films at the SiO2 interface, APPL SURF S, 158(1-2), 2000, pp. 1-10
Authors:
Niu, C
Shepherd, K
Martini, D
Tong, J
Kelber, JA
Jennison, DR
Bogicevic, A
Citation: C. Niu et al., Cu interactions with alpha-Al2O3(0001): effects of surface hydroxyl groupsversus dehydroxylation by Ar-ion sputtering, SURF SCI, 465(1-2), 2000, pp. 163-176
Authors:
Addepalli, SG
Magtoto, NP
Kelber, JA
Citation: Sg. Addepalli et al., H2S adsorption and the effect of sulfur on the oxidation of Ni3Al(111), SURF SCI, 458(1-3), 2000, pp. 123-134
Authors:
Kelber, JA
Niu, CY
Shepherd, K
Jennison, DR
Bogicevic, A
Citation: Ja. Kelber et al., Copper wetting of alpha-Al2O3(0001): theory and experiment, SURF SCI, 446(1-2), 2000, pp. 76-88
Authors:
Chen, L
Magtoto, NP
Addepalli, S
Ekstrom, B
Kelber, JA
Citation: L. Chen et al., S-induced destabilization of aluminum oxide at the Fe(poly)-S-Al2O3 interface, OXID METAL, 54(3-4), 2000, pp. 285-300
Authors:
Xu, HC
Seshadri, G
Kelber, JA
Citation: Hc. Xu et al., Effect of sulfur on the oxidation of copper in aqueous solution, J ELCHEM SO, 147(2), 2000, pp. 558-561
Authors:
Magtoto, NP
Niu, C
Ekstrom, BM
Addepalli, S
Kelber, JA
Citation: Np. Magtoto et al., Dielectric breakdown of ultrathin aluminum oxide films induced by scanningtunneling microscopy, APPL PHYS L, 77(14), 2000, pp. 2228-2230
Authors:
Chen, L
Kelber, JA
Citation: L. Chen et Ja. Kelber, Polymerized C-Si films on metal substrates: Cu adhesion diffusion barriersfor ultralarge scale integration?, J VAC SCI A, 17(4), 1999, pp. 1968-1973
Authors:
Addepalli, SG
Ekstrom, B
Magtoto, NP
Lin, JS
Kelber, JA
Citation: Sg. Addepalli et al., STM atomic-scale characterization of the gamma '-Al2O3 film on Ni3Al(111), SURF SCI, 442(3), 1999, pp. 385-399
Authors:
Addepalli, SG
Lin, JS
Ekstrom, B
Kelber, JA
Citation: Sg. Addepalli et al., Interactions at the Al-S-Fe interface: S inhibition of aluminum oxidation, OXID METAL, 52(1-2), 1999, pp. 139-153
Authors:
Seshadri, G
Xu, HC
Kelber, JA
Citation: G. Seshadri et al., Sulfur catalyzed electrochemical oxidation of copper: A combined ultrahighvacuum electrochemistry study, J ELCHEM SO, 146(5), 1999, pp. 1762-1765
Authors:
Seshadri, G
Kelber, JA
Citation: G. Seshadri et Ja. Kelber, A study of the electrochemical reduction of nitrobenzene at molybdenum electrodes, J ELCHEM SO, 146(10), 1999, pp. 3762-3764
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