Citation: R. Ghaffarian et Np. Kim, Reliability and failure analyses of thermally cycled ball grid array assemblies, IEEE T COMP, 23(3), 2000, pp. 528-534
Citation: Jl. Wu et al., Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation, IEEE T AD P, 23(4), 2000, pp. 721-728