Login
|
New Account
AAAAAA
ITA
ENG
Results:
1-1
|
Results: 1
Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer joints
Authors:
Kong, DI Park, CE Hong, ST Yang, HC Kim, KT
Citation:
Di. Kong et al., Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer joints, J ADHES SCI, 13(7), 1999, pp. 805-818
Risultati:
1-1
|