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Results: 1-7 |
Results: 7
THERMOMECHANICAL FAILURES IN MICROELECTRONIC INTERCONNECTS
Authors: EVANS JW EVANS JY LALL P CORNFORD SL
Citation: Jw. Evans et al., THERMOMECHANICAL FAILURES IN MICROELECTRONIC INTERCONNECTS, Microelectronics and reliability, 38(4), 1998, pp. 523-529
PERSPECTIVES TO UNDERSTAND RISKS HN THE ELECTRONIC INDUSTRY
Authors: DASGUPTA A MAGRAB EB ANAND DK EISINGER K MCLEISH JG TORRES MA LALL P DISHONGH TJ
Citation: A. Dasgupta et al., PERSPECTIVES TO UNDERSTAND RISKS HN THE ELECTRONIC INDUSTRY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 542-547
THERMAL DERATING - A FACTOR OF SAFETY OR IGNORANCE
Authors: JACKSON MA LALL P DAS D
Citation: Ma. Jackson et al., THERMAL DERATING - A FACTOR OF SAFETY OR IGNORANCE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(1), 1997, pp. 83-85
TUTORIAL - TEMPERATURE AS AN INPUT TO MICROELECTRONICS-RELIABILITY MODELS
Authors: LALL P
Citation: P. Lall, TUTORIAL - TEMPERATURE AS AN INPUT TO MICROELECTRONICS-RELIABILITY MODELS, IEEE transactions on reliability, 45(1), 1996, pp. 3-9
CHARACTERIZATION OF FUNCTIONAL-RELATIONSHIP BETWEEN TEMPERATURE AND MICROELECTRONIC RELIABILITY
Authors: LALL P PECHT M HAKIM EB
Citation: P. Lall et al., CHARACTERIZATION OF FUNCTIONAL-RELATIONSHIP BETWEEN TEMPERATURE AND MICROELECTRONIC RELIABILITY, Microelectronics and reliability, 35(3), 1995, pp. 377-402
DEVELOPMENT OF AN ALTERNATIVE WIRE BOND TEST TECHNIQUE
Authors: PECHT M BARKER D LALL P
Citation: M. Pecht et al., DEVELOPMENT OF AN ALTERNATIVE WIRE BOND TEST TECHNIQUE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 610-615
AN OVERVIEW OF MULTICHIP MODULES
Authors: LALL P BHAGATH S
Citation: P. Lall et S. Bhagath, AN OVERVIEW OF MULTICHIP MODULES, Solid state technology, 36(9), 1993, pp. 65
Risultati: 1-7 |