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Authors: LARCOMBE SP STERN JM IVEY PA SEED L

Citation: Sp. Larcombe et al., UTILIZING A LOW-COST 3D PACKAGING TECHNOLOGY FOR CONSUMER APPLICATIONS, IEEE transactions on consumer electronics, 41(4), 1995, pp. 1095-1102

Authors: LARCOMBE SP IVEY PA SEED NL STERN JM VAL CM

Citation: Sp. Larcombe et al., ELECTRONIC SYSTEMS IN DENSE 3-DIMENSIONAL PACKAGES, Electronics Letters, 31(10), 1995, pp. 786-788