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Results:
1-7
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Results: 7
Authors:
LAVERTY SJ
FENG H
MAGUIRE P
Citation: Sj. Laverty et al., ADHESION OF COPPER ELECTROPLATED TO THIN-FILM TIN OXIDE FOR ELECTRODES IN FLAT-PANEL DISPLAYS, Journal of the Electrochemical Society, 144(6), 1997, pp. 2165-2170
Authors:
MAGUIRE P
MOLLOY J
LAVERTY SJ
MCLAUGHLIN J
Citation: P. Maguire et al., ETCHING CHARACTERISTICS OF TIN OXIDE THIN-FILMS IN ARGON-CHLORINE RADIO-FREQUENCY PLASMAS, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 14(6), 1996, pp. 3010-3016
Authors:
FENG H
LAVERTY SJ
MAGUIRE P
MOLLOY J
MEENAN BJ
Citation: H. Feng et al., ELECTROCHEMICALLY REDUCED POLYCRYSTALLINE TIN OXIDE THIN-FILMS - SURFACE-ANALYSIS AND ELECTROPLATED COPPER ADHESION, Journal of the Electrochemical Society, 143(6), 1996, pp. 2048-2052
Authors:
FARBER JA
LAVERTY SJ
EDER A
MAGUIRE P
Citation: Ja. Farber et al., PULSE-COMPRESSION ON AN HLN-TRANSMISSION LINE IN GAAS TECHNOLOGY AS ABASIS FOR AN INTEGRATED SAMPLING HEAD DRIVER MODULE, IEEE transactions on instrumentation and measurement, 44(4), 1995, pp. 918-919
Authors:
MOLLOY J
MAGUIRE P
LAVERTY SJ
MCLAUGHLIN JA
Citation: J. Molloy et al., THE REACTIVE ION ETCHING OF TRANSPARENT ELECTRODES FOR FLAT-PANEL DISPLAYS USING AR CL-2 PLASMAS/, Journal of the Electrochemical Society, 142(12), 1995, pp. 4285-4289
Authors:
BLAKLEY JJ
WEBB JAC
LAVERTY SJ
Citation: Jj. Blakley et al., COMBINATIONAL LOGIC-FREE 3-LEVEL M-SEQUENCE GENERATION USING TERNARY J(3)K(3) FLIP-FLOP LOGIC PRIMITIVES, International journal of electronics, 77(6), 1994, pp. 1067-1075
Authors:
LIU JS
LAVERTY SJ
MAGUIRE P
MCLAUGHLIN J
MOLLOY J
Citation: Js. Liu et al., THE ROLE OF AN ELECTROLYSIS REDUCTION IN COPPER-ELECTROPLATING ON TRANSPARENT SEMICONDUCTOR TIN OXIDE, Journal of the Electrochemical Society, 141(4), 1994, pp. 120000038-120000040
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