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Results: 1-11 |
Results: 11
GLOB-TOP RELIABILITY CHARACTERIZATION - EVALUATION AND ANALYSIS-METHODS
Authors: DOYLE R OFLYNN B LAWTON W BARRETT J BUCKLEY J
Citation: R. Doyle et al., GLOB-TOP RELIABILITY CHARACTERIZATION - EVALUATION AND ANALYSIS-METHODS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 292-300
CONVERGENCE OF MULTIDIMENSIONAL CASCADE ALGORITHM
Authors: LAWTON W LEE SL SHEN ZW
Citation: W. Lawton et al., CONVERGENCE OF MULTIDIMENSIONAL CASCADE ALGORITHM, Numerische Mathematik, 78(3), 1998, pp. 427-438
A FAST ALGORITHM TO MAP FUNCTIONS FORWARD
Authors: LAWTON W
Citation: W. Lawton, A FAST ALGORITHM TO MAP FUNCTIONS FORWARD, Multidimensional systems and signal processing, 8(1-2), 1997, pp. 219-227
STABILITY AND ORTHONORMALITY OF MULTIVARIATE REFINABLE FUNCTIONS
Authors: LAWTON W LEE SL SHEN ZW
Citation: W. Lawton et al., STABILITY AND ORTHONORMALITY OF MULTIVARIATE REFINABLE FUNCTIONS, SIAM journal on mathematical analysis, 28(4), 1997, pp. 999-1014
A CONTINUUM MECHANICS-BASED MODEL FOR CORTICAL GROWTH
Authors: RAGHAVAN R LAWTON W RANJAN SR VISWANATHAN RR
Citation: R. Raghavan et al., A CONTINUUM MECHANICS-BASED MODEL FOR CORTICAL GROWTH, Journal of theoretical biology, 187(2), 1997, pp. 285-296
IMPORTANCE OF MOLDING COMPOUND CHEMICAL SHRINKAGE IN THE STRESS AND WARPAGE ANALYSIS OF PQFPS
Authors: KELLY G LYDEN C LAWTON W BARRETT J SABOUI A PAPE H PETERS HJB
Citation: G. Kelly et al., IMPORTANCE OF MOLDING COMPOUND CHEMICAL SHRINKAGE IN THE STRESS AND WARPAGE ANALYSIS OF PQFPS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(2), 1996, pp. 296-300
INFORMATION-THEORY, WAVELETS, AND IMAGE COMPRESSION
Authors: LAWTON W
Citation: W. Lawton, INFORMATION-THEORY, WAVELETS, AND IMAGE COMPRESSION, International journal of imaging systems and technology, 7(3), 1996, pp. 180-190
CHARACTERIZATION OF CHIP-ON-BOARD AND FLIP-CHIP PACKAGING TECHNOLOGIES BY ACOUSTIC MICROSCOPY
Authors: LAWTON W BARRETT J
Citation: W. Lawton et J. Barrett, CHARACTERIZATION OF CHIP-ON-BOARD AND FLIP-CHIP PACKAGING TECHNOLOGIES BY ACOUSTIC MICROSCOPY, Microelectronics and reliability, 36(11-12), 1996, pp. 1803-1806
AN ALGORITHM FOR MATRIX EXTENSION AND WAVELET CONSTRUCTION
Authors: LAWTON W LEE SL SHEN ZW
Citation: W. Lawton et al., AN ALGORITHM FOR MATRIX EXTENSION AND WAVELET CONSTRUCTION, Mathematics of computation, 65(214), 1996, pp. 723-737
METHODS OF ANALYZING THERMOMECHANICAL STRESS IN PLASTIC PACKAGES FOR INTEGRATED-CIRCUITS
Authors: SLATTERY O HAYES T LAWTON W KELLY G LYDEN C BARRETT J OMATHUNA C
Citation: O. Slattery et al., METHODS OF ANALYZING THERMOMECHANICAL STRESS IN PLASTIC PACKAGES FOR INTEGRATED-CIRCUITS, Journal of materials processing technology, 54(1-4), 1995, pp. 199-204
APPLICATIONS OF COMPLEX-VALUED WAVELET TRANSFORMS TO SUBBAND DECOMPOSITION
Authors: LAWTON W
Citation: W. Lawton, APPLICATIONS OF COMPLEX-VALUED WAVELET TRANSFORMS TO SUBBAND DECOMPOSITION, IEEE transactions on signal processing, 41(12), 1993, pp. 3566-3568
Risultati: 1-11 |