CHARACTERIZATION OF CHIP-ON-BOARD AND FLIP-CHIP PACKAGING TECHNOLOGIES BY ACOUSTIC MICROSCOPY

In recent years scanning acoustic microscopy (SAM) has been found to b e a very successful technique when used in the microelectronics indust ry to evaluate,from a reliability perspective, standard plastic packag ing technologies such as PQFP's, PLCC's, DIP's and SOP's. Very little research has been reported in the application of SAM as a technique fo r determining the quality and reliability of packaging technologies su ch as Chipon-Board (COB) and Flip Chip adhered devices, however. These areas will be addressed in this paper. Copyright (C) 1996 Elsevier Sc ience Ltd