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Results: 1-9 |
Results: 9
TRANSIENT AND STEADY-STATE THERMAL DESIGN EVALUATION OF A CARBON-MONOXIDE GAS SENSOR USING CFD TOOL
Authors: LEE TYT SHARMA R PEYRELAVIGNE A
Citation: Tyt. Lee et al., TRANSIENT AND STEADY-STATE THERMAL DESIGN EVALUATION OF A CARBON-MONOXIDE GAS SENSOR USING CFD TOOL, Journal of electronic packaging, 120(2), 1998, pp. 135-140
THERMAL LIMITS OF FLIP-CHIP PACKAGE - EXPERIMENTALLY VALIDATED, CFD SUPPORTED CASE-STUDIES
Authors: LEE TYT MAHALINGAM M
Citation: Tyt. Lee et M. Mahalingam, THERMAL LIMITS OF FLIP-CHIP PACKAGE - EXPERIMENTALLY VALIDATED, CFD SUPPORTED CASE-STUDIES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(1), 1997, pp. 94-103
LIQUID ENCAPSULATED MCM PACKAGE - THERMAL DEMONSTRATION
Authors: LEE TYT HAUSE V MAHALINGAM M
Citation: Tyt. Lee et al., LIQUID ENCAPSULATED MCM PACKAGE - THERMAL DEMONSTRATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(2), 1997, pp. 120-127
A NUMERICAL STUDY OF LOCAL AND AVERAGE NATURAL-CONVECTION NUSSELT NUMBERS FOR SIMULTANEOUS CONVECTION ABOVE AND BELOW A UNIFORMLY HEATED HORIZONTAL THIN-PLATE
Authors: CHAMBERS B LEE TYT
Citation: B. Chambers et Tyt. Lee, A NUMERICAL STUDY OF LOCAL AND AVERAGE NATURAL-CONVECTION NUSSELT NUMBERS FOR SIMULTANEOUS CONVECTION ABOVE AND BELOW A UNIFORMLY HEATED HORIZONTAL THIN-PLATE, Journal of heat transfer, 119(1), 1997, pp. 102-108
THE STRESS AND STRENGTH AT THE NECK OF A LARGE-DIAMETER SILICON CRYSTAL DURING GROWTH
Authors: CHIOU HD LEE TYT TENG S
Citation: Hd. Chiou et al., THE STRESS AND STRENGTH AT THE NECK OF A LARGE-DIAMETER SILICON CRYSTAL DURING GROWTH, Journal of the Electrochemical Society, 144(8), 1997, pp. 2881-2886
APPLICATION OF A CFD TOOL IN DESIGNING A FOUNTAIN PLATING CELL FOR UNIFORM BUMP PLATING OF SEMICONDUCTOR WAFERS
Authors: LEE TYT LYTLE WH HILEMAN B
Citation: Tyt. Lee et al., APPLICATION OF A CFD TOOL IN DESIGNING A FOUNTAIN PLATING CELL FOR UNIFORM BUMP PLATING OF SEMICONDUCTOR WAFERS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 131-137
THERMAL EVALUATION OF A POWERPC-620 MICROPROCESSOR IN A MULTIPROCESSOR COMPUTER
Authors: WONG H LEE TYT
Citation: H. Wong et Tyt. Lee, THERMAL EVALUATION OF A POWERPC-620 MICROPROCESSOR IN A MULTIPROCESSOR COMPUTER, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 469-477
APPLICATION OF CFD TECHNOLOGY TO ELECTRONIC THERMAL MANAGEMENT
Authors: LEE TYT CHAMBERS B MAHALINGAM M
Citation: Tyt. Lee et al., APPLICATION OF CFD TECHNOLOGY TO ELECTRONIC THERMAL MANAGEMENT, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 511-520
APPLICATION OF A CFD TOOL FOR SYSTEM-LEVEL THERMAL SIMULATION
Authors: LEE TYT MAHALINGAM M
Citation: Tyt. Lee et M. Mahalingam, APPLICATION OF A CFD TOOL FOR SYSTEM-LEVEL THERMAL SIMULATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 564-572
Risultati: 1-9 |