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Results:
1-7
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Results: 7
Authors:
LIN CC
CHEN WS
HWANG HL
HSU KYJ
LIOU HK
TU KN
Citation: Cc. Lin et al., RELIABILITY STUDY OF SUBMICRON TITANIUM SILICIDE CONTACTS, Applied surface science, 92, 1996, pp. 660-664
Authors:
HUANG JS
LIOU HK
TU KN
Citation: Js. Huang et al., POLARITY EFFECT OF ELECTROMIGRATION IN NI2SI CONTACTS ON SI, Physical review letters, 76(13), 1996, pp. 2346-2349
Authors:
WANG Y
KIM HK
LIOU HK
TU KN
Citation: Y. Wang et al., RAPID SOLDERING REACTIONS OF EUTECTIC SNPB AND EUTECTIC SNBI ON PD SURFACES, Scripta metallurgica et materialia, 32(12), 1995, pp. 2087-2092
Authors:
KIM HK
LIOU HK
TU KN
Citation: Hk. Kim et al., MORPHOLOGY OF INSTABILITY OF THE WETTING TIPS OF EUTECTIC SNBI, EUTECTIC SNPB, AND PURE SN ON CU, Journal of materials research, 10(3), 1995, pp. 497-504
Authors:
LIOU HK
HUANG JS
TU KN
Citation: Hk. Liou et al., OXIDATION OF CU AND CU3GE THIN-FILMS, Journal of applied physics, 77(10), 1995, pp. 5443-5445
Authors:
KIM HK
LIOU HK
TU KN
Citation: Hk. Kim et al., 3-DIMENSIONAL MORPHOLOGY OF A VERY ROUGH INTERFACE FORMED IN THE SOLDERING REACTION BETWEEN EUTECTIC SNPB AND CU, Applied physics letters, 66(18), 1995, pp. 2337-2339
Authors:
LIOU HK
YANG ES
TU KN
Citation: Hk. Liou et al., NONALLOYED OHMIC CONTACTS TO N-SI USING A STRAINED SI0.50GE0.50 BUFFER LAYER, Applied physics letters, 63(7), 1993, pp. 911-913
Risultati:
1-7
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