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Results: 1
Endurance of thermoset resins for flip chip encapsulation
Authors:
Sarkar, G Ng, HW Law, SB
Citation:
G. Sarkar et al., Endurance of thermoset resins for flip chip encapsulation, J MAT SCI L, 18(5), 1999, pp. 423-424
Risultati:
1-1
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