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Results:
1-7
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Results: 7
Authors:
Vyvoda, MA
Li, M
Graves, DB
Lee, H
Malyshev, MV
Klemens, FP
Lee, JTC
Donnelly, VM
Citation: Ma. Vyvoda et al., Role of sidewall scattering in feature profile evolution during Cl-2 and HBr plasma etching of silicon, J VAC SCI B, 18(2), 2000, pp. 820-833
Authors:
Lane, J
Rietman, EA
Layadi, N
Lee, JTC
Citation: J. Lane et al., Mapping of wafer profile to plasma processing conditions: Forward and reverse maps, J VAC SCI B, 18(1), 2000, pp. 299-302
Authors:
Lane, JM
Bogart, KHA
Klemens, FP
Lee, JTC
Citation: Jm. Lane et al., The role of feedgas chemistry, mask material, and processing parameters inprofile evolution during plasma etching of Si(100), J VAC SCI A, 18(5), 2000, pp. 2067-2079
Authors:
Lane, JM
Klemens, FP
Bogart, KHA
Malyshev, MV
Lee, JTC
Citation: Jm. Lane et al., Feature evolution during plasma etching. II. Polycrystalline silicon etching, J VAC SCI A, 18(1), 2000, pp. 188-196
Authors:
Bogart, KHA
Klemens, FP
Malyshev, MV
Colonell, JI
Donnelly, VM
Lee, JTC
Lane, JM
Citation: Kha. Bogart et al., Mask charging and profile evolution during chlorine plasma etching of silicon, J VAC SCI A, 18(1), 2000, pp. 197-206
Authors:
Layadi, N
Colonell, JI
Lee, JTC
Citation: N. Layadi et al., An introduction to plasma etching for VLSI circuit technology, BELL LABS T, 4(3), 1999, pp. 155-171
Authors:
Malyshev, MV
Donnelly, VM
Kornblit, A
Ciampa, NA
Colonell, JI
Lee, JTC
Citation: Mv. Malyshev et al., Langmuir probe studies of a transformer-coupled plasma, aluminum etcher, J VAC SCI A, 17(2), 1999, pp. 480-492
Risultati:
1-7
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