Authors: Shidore, S Adams, V Lee, TYT

Citation: S. Shidore et al., A study of compact thermal model topologies in CFD for a flip chip plasticball grid array package, IEEE T COMP, 24(2), 2001, pp. 191-198

Authors: Phelan, PE Chiriac, V Lee, TYT

Citation: Pe. Phelan et al., Current and future miniature refrigeration cooling technologies for high power microelectronics, P IEEE SEM, 2001, pp. 158-167

Authors: Shidore, S Lee, TYT

Citation: S. Shidore et Tyt. Lee, A comparative study of the performance of compact model topologies and their implementation in CFD for a Plastic Ball Grid Array package, J ELEC PACK, 123(3), 2001, pp. 232-237

Authors: Lee, TYT

Citation: Tyt. Lee, An investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool, IEEE T COMP, 23(3), 2000, pp. 481-489

Authors: Guo, YF Mitchell, D Sarihan, V Lee, TYT Zheng, DW

Citation: Yf. Guo et al., A testing method and device for intrinsic stress measurement in wafer bumping process, IEEE T COMP, 23(2), 2000, pp. 388-392

Authors: Lee, TYT Ramakrishna, K Amon, CK

Citation: Tyt. Lee et al., Foreword - Contributions from the ITherm'98 to thermal management, IEEE T COMP, 23(1), 2000, pp. 3-5